High-speed exposure is used so that a precise inspection of the target can be performed even if the target is vibrating, making accurate measurement possible.
By integrating the peripheral circuits of the measurement CMOS into one chip, the S/N ratio has been dramatically improved and high-speed sampling achieved. For example, targets that move at 1,000 m/min. can be measured at a pitch of around 1 mm. Even parts that vibrate at high speeds can be measured stably.
The target monitor CMOS recognises the orientation of the part and adjusts the measured value so there are no measurement errors due to inclination.
Recognises the misalignment of a workpiece from the image taken by the monitor CMOS. Inclination error is removed automatically and does not affect the measurement result. The captured image can also be checked with computer software so even novices will have no problem taking measurements.
The LS-9000 can use the target positioning CMOS receiver to determine the location of the measurement target in two axes. This makes installation and part position feedback simple, even with a single axis system.
With the additional data obtained from the target positioning CMOS, the LS-9000 can determine the position of the target in both the X and Y axes.
Specialized ultra-fine diameter / gap tool now allows measurement of gaps and diameters previously undetectable.