UK & Ireland

Height measurement of a wire bond

Height measurement of a wire bond

Semiconductor manufacturing

Defects in bonding wires can cause a ciruit board to malfunction.

Benefit

The 2 μm beam spot and double scanning method ensures stable measurements.

LEARN THE DETAILS OF THE PRODUCT

  • Surface scanning laser displacement meter. Z-axis scanning for accuracy and resolution. X-axis scanning for stability. Transparents targets are not a problem.

  • The revolutionary new displacement meter with 0.1-μm precision

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