UK & Ireland
Fully Operational with Expanded Resources Click for the latest on how KEYENCE is continuing to support our customers with quick delivery, off-site testing, virtual demos and more.

Height measurement of a wire bond

Height measurement of a wire bond

Semiconductor manufacturing

Defects in bonding wires can cause a ciruit board to malfunction.

Benefit

The 2 μm beam spot and double scanning method ensures stable measurements.

LEARN THE DETAILS OF THE PRODUCT

  • Surface scanning laser displacement meter. Z-axis scanning for accuracy and resolution. X-axis scanning for stability. Transparents targets are not a problem.